| Common metals | 316L at 170 MPa / 25 ksi yield with a pitting resistance number of 24 to 26; 17-4 PH from 760 MPa / 110 ksi in Condition A; Ti Grade 5 at 880 MPa / 128 ksi | Grade and condition stated in full, not the family name |
| Common polymers | PEEK at about 100 MPa tensile with a heat-deflection figure near 152 °C at 1.8 MPa; acetal at 70 MPa; PEI at 105 MPa | Whether the polymer survives the sterilisation route |
| Steam sterilisation | Autoclave cycles run around 121 °C to 134 °C — PEEK and PEI tolerate it, acetal at roughly 90 °C continuous service does not | The sterilisation method stated before the material is fixed |
| Wetted surface finish | Commonly Ra 0.8 µm or better, and Ra 0.4 µm where cleaning validation requires it | Roughness as a stated requirement with a measurement method under ASME B46.1 |
| Electropolishing | Removes 10 to 40 µm and improves Ra by typically 25 to 50%, passivating in the same operation, commonly to ASTM B912 | Dimensional allowance designed in for the removal |
| Passivation | A separate specified operation, normally to ASTM A967; citric methods are preferred for martensitic and precipitation-hardening grades | The grade decides the method |
| Crevices and dead legs | Internal corners, blind holes and lap joints trap fluid and defeat cleaning regardless of surface finish | Geometry reviewed for cleanability, not just finish |
| Traceability | Material certificates to ASTM A276 or equivalent, lot boundaries, process handoffs and part identity as separate requirements | Where the lot boundary sits, and whether lots may be mixed |
| Part marking | Laser annealing leaves no material removal; engraving removes 5 to 50 µm and breaches the passive layer | Marking method, position and whether passivation follows |
| Prototype to production | A printed prototype at 30 to 70% interlayer strength does not represent a machined or moulded production part | Which conclusions the prototype supports |
| Cleanroom | A distinct and costly requirement separate from controlled cleaning and from a cleanliness test | Which is actually required |
| What a component supplier cannot provide | Device-level regulatory compliance, biocompatibility conclusions or sterilisation validation | Those remain with the device owner |